CONTENTS

This course offers a more advanced treatment of digital design in the context of microprocessors. With a special emphasis on:

Course presentation [pdf]

  1. Moore’s Law & Dennard Scaling
    a.Transistor: basic physics
  2. Manufacturing (high volume)
    a.Lithography, Etching
    b.Test & Assembly
    c.Packaging, 3D Stacking, Interposer & Boards
    d.DFT (Design For Testing)
  3. Memory, processor-on-memory
    a.DRAM & DIMMs, NVRAM
  4. ASIC vs FPGA
  5. Design Cycle 
    a.RTL Coding 
    b.Verification 
    c.Synthesis 
    d.Placement & Routing. Infrastructure setup and test. 
Effective Oral and Written Technical Communication [pdf][pdf1]
 
Previous editions syllabus [link]
BIBLIOGRAPHY: